Journal Article
RDF
pages:
-
THERMAL [2+2] CYCLOADDITION OF 1,1-DIMETHOXYETHENE TO CARBONYL OF 2-ETHOXY-3-INDOLONE
-
Thermal [6,6] → [6,6] Isomerization and Decomposition of PCBM (Phenyl-C61-butyric Acid Methyl Ester)
-
Thermal acclimation in a non-migratory songbird occurs via changes to thermogenic capacity, but not conductance
-
Thermal activation of tert-butyl nitrite on Pt(111): tert-butoxy dehydrogenation and oxametallacycle formation
-
Thermal analysis of micromirrors for high-energy applications
-
Thermal Analysis of the Exothermic Reaction between Galvanic Porous Silicon and Sodium Perchlorate
-
THERMAL AND DYNAMIC EFFECTS OF PAIR PRODUCTION ON 2-TEMPERATURE ACCRETION FLOWS
-
Thermal and Environmental Stability of Semi-Transparent Perovskite Solar Cells for Tandems Enabled by a Solution-Processed Nanoparticle Buffer Layer and Sputtered ITO Electrode
-
Thermal and Illumination Environments of Lunar Pits and Caves: Models and Observations From the Diviner Lunar Radiometer Experiment
-
Thermal and magnetic properties of the spin-chain material Pr3RuO7
-
Thermal and Nonlinear Dissipative-Soliton Dynamics in Kerr-Microresonator Frequency Combs
-
Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock
-
Thermal and thermo-oxidative degradation of tetrafluoroethylene-propylene elastomer above 300 °C
-
Thermal asperity trends
-
Thermal Atomic Layer Etching of Al2O3 Using Sequential HF and BCl3 Exposures: Evidence for Combined Ligand-Exchange and Conversion Mechanisms
-
Thermal Atomic Layer Etching of Al2O3, HfO2, and ZrO2 Using Sequential Hydrogen Fluoride and Dimethylaluminum Chloride Exposures
-
Thermal Atomic Layer Etching of Aluminum Nitride Using HF orXeF2 for Fluorination and BCl3 for Ligand Exchange
-
Thermal atomic layer etching of amorphous and crystalline Al2O3 films
-
Thermal atomic layer etching of cobalt using sulfuryl chloride for chlorination and tetramethylethylenediamine or trimethylphosphine for ligand addition
-
Thermal atomic layer etching of CoO using acetylacetone and ozone: Evidence for changes in oxidation state and crystal structure during sequential exposures
-
Thermal Atomic Layer Etching of CoO, ZnO, Fe2O3, and NiO by Chlorination and Ligand Addition Using SO2Cl2 and Tetramethylethylenediamine
-
Thermal atomic layer etching of crystalline aluminum nitride using sequential, self-limiting hydrogen fluoride and Sn(acac)2 reactions and enhancement by H2 and Ar plasmas
-
Thermal atomic layer etching of crystalline GaN using sequential exposures of XeF2 and BCl3
-
Thermal Atomic Layer Etching of Gallium Oxide Using Sequential Exposures of HF and Various Metal Precursors
-
Thermal atomic layer etching of germanium-rich SiGe using an oxidation and "conversion-etch" mechanism
-
Thermal Atomic Layer Etching of Gold Using Sulfuryl Chloride for Chlorination and Triethylphosphine for Ligand Addition
-
Thermal atomic layer etching of HfO2 using HF for fluorination and TiCl4 for ligand-exchange
-
Thermal Atomic Layer Etching of Molybdenum Using Sequential Oxidation and Deoxychlorination Reactions
-
Thermal Atomic Layer Etching of Nickel Using Sequential Chlorination and Ligand-Addition Reactions
-
Thermal atomic layer etching of silicon nitride using an oxidation and "conversion etch" mechanism
pages: