Effect of surface morphology on the deformation mechanism of Cu nanocrystal under cyclic loading at different temperatures: Molecular dynamics simulations
Journal Article
Overview
publication date
- December 1, 2024
Date in CU Experts
- April 21, 2025 4:29 AM
Full Author List
- Su R; Wang X; Li H; Chen H
author count
- 4
citation count
- 0
published in
- Materials Today Communications Journal
Other Profiles
Electronic International Standard Serial Number (EISSN)
- 2352-4928
Digital Object Identifier (DOI)
Additional Document Info
volume
- 41
number
- ARTN 110686