publication date
- April 1, 2012
Evolution of stress gradients in Cu films and features induced by capping layers
Journal Article
Overview
has restriction
- closed
Date in CU Experts
- November 5, 2020 2:39 AM
Full Author List
- Murray CE; Ryan ET; Besser PR; Witt C; Jordan-Sweet JL; Toney MF
author count
- 6
citation count
- 0
published in
- Microelectronic Engineering Journal
Other Profiles
International Standard Serial Number (ISSN)
- 0167-9317
Electronic International Standard Serial Number (EISSN)
- 1873-5568
Digital Object Identifier (DOI)
Additional Document Info
start page
- 95
end page
- 100
volume
- 92